Principal Investigator: Dr. Xiaoqing Song
This project aims to develop a new press-pack power module technology that can fully harness the advantages of next-generation semiconductor devices such as silicon carbide (SiC) and gallium oxide (Ga₂O₃). Traditional press-pack modules, widely used in high-voltage DC transmission and grid applications, are not directly compatible with these faster and more powerful devices due to limitations in electrical design and insulation. The proposed research introduces an innovative press-pack module design that minimizes electrical losses, improves cooling efficiency, and ensures reliable operation under extreme conditions. A prototype 3.3 kV, 200 A SiC module will be developed and tested, paving the way for more compact, efficient, and sustainable power conversion systems in transportation, grid, and industrial applications.
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